Thorsten Meyer
Senior Principal Package Concept Engineering @ Infineon Technologies
About Thorsten Meyer
23 years+ experience in packaging technologies 19 years+ experience in Wafer Level Packaging technology 160+ patents and patent applications in packaging technology area Spezialgebiete: - Packaging - Wafer Level Packaging, ELASTec - Embedded Wafer Level Ball Grid Array (eWLB) - Fan-Out Wafer Level Packages, Embedded Die, Flip Chip - System Integration - Patents